Gated metal-insulator-semiconductor (mis) tunnel diode having negative transconductance

ABSTRACT

Gated MIS tunnel diode devices having a controllable negative transconductance behavior are provided. In some embodiments, a device includes a substrate, a tunnel diode dielectric layer on a surface of the substrate, and a gate dielectric layer on the surface of the substrate and adjacent to the tunnel diode dielectric layer. A tunnel diode electrode is disposed on the tunnel diode dielectric layer, and a gate electrode is disposed on the gate dielectric layer. A substrate electrode is disposed on the surface of the substrate, and the tunnel diode electrode is positioned between the gate electrode and the substrate electrode.

BACKGROUND

Semiconductor devices that exhibit negative transconductance over atleast some operating regions may be referred to as negativetransconductance devices. Some examples of negative transconductancedevices include tunnel diodes, tunneling field effect transistors(TFET), and resonant-tunneling transistors.

Conventional negative transconductance devices generally have arelatively low peak-to-valley current ratio (PVCR). The limited PVCR ofsuch negative transconductance devices may limit the usefulness ofconventional negative transconductance devices in a variety ofapplications.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a cross-sectional view illustrating a gated MIS-tunnel diodedevice, in accordance with some embodiments.

FIGS. 2A to 2H are cross-sectional views illustrating a method offorming a gated MIS-tunnel diode device, in accordance with someembodiments.

FIG. 3 is a cross-sectional view illustrating a gated MIS-tunnel diodedevice having a vertical or fin structure, in accordance with someembodiments.

FIGS. 4A to 4E are cross-sectional views illustrating a method offorming a gated MIS-tunnel diode device, in accordance with someembodiments.

FIG. 5 is a top plan view illustrating a device having a gate electrodethat laterally surrounds a tunnel diode electrode, in accordance withsome embodiments.

FIG. 6 is a top plan view illustrating a device having a gate electrodethat laterally surrounds a tunnel diode electrode, in accordance withsome embodiments.

FIG. 7 is a top plan view illustrating a device having a tunnel diodeelectrode that laterally surrounds a gate electrode, in accordance withsome embodiments.

FIG. 8 is a top plan view illustrating a device having a tunnel diodeelectrode that laterally surrounds a gate electrode, in accordance withsome embodiments.

FIG. 9 is a top plan view illustrating a device having a gate electrodeand a tunnel diode electrode provided in a parallel layout, inaccordance with some embodiments.

FIG. 10 is a top plan view illustrating a device having a gate electrode910 and a tunnel diode electrode provided in a “fingers” layout, inaccordance with some embodiments.

FIG. 11 is a top plan view illustrating a device having a multi-gatelayout, in accordance with some embodiments.

FIG. 12 is a top plan view illustrating a device having a multi-gatelayout, in accordance with some embodiments.

FIG. 13 is a top plan view illustrating a device having a multi-gatelayout, in accordance with some embodiments.

FIG. 14 is a top plan view illustrating a device having a multi-gatelayout, in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Reference throughout the specification to deposition techniques fordepositing dielectric layers, metals, or any other materials includessuch processes as chemical vapor deposition (CVD), low-pressure chemicalvapor deposition (LPCVD), metal organic chemical vapor deposition(MOCVD), plasma-enhanced chemical vapor deposition (PECVD), plasma vapordeposition (PVD), atomic layer deposition (ALD), molecular beam epitaxy(MBE), electroplating, electro-less plating, and the like. Specificembodiments are described herein with reference to examples of suchprocesses. However, the present disclosure and the reference to certaindeposition techniques should not be limited to those described.

Reference throughout the specification to etching techniques forselective removal of dielectric materials, metals, or any othermaterials includes such processes as wet chemical etching, reactive ion(plasma) etching (RIE), washing, wet cleaning, pre-cleaning, spraycleaning, chemical-mechanical planarization (CMP) and the like. Specificembodiments are described herein with reference to examples of suchprocesses. However, the present disclosure and the reference to certainetching techniques should not be limited to those described.

The fin structures may be patterned by any suitable method. For example,the structures may be patterned using one or more photolithographyprocesses, including double-patterning or multi-patterning processes.Generally, double-patterning or multi-patterning processes combinephotolithography and self-aligned processes, allowing patterns to becreated that have, for example, pitches smaller than what is otherwiseobtainable using a single, direct photolithography process. For example,in one embodiment, a sacrificial layer is formed over a substrate andpatterned using a photolithography process. Spacers are formed alongsidethe patterned sacrificial layer using a self-aligned process. Thesacrificial layer is then removed, and the remaining spacers may then beused to pattern the fin structure.

FIG. 1 is a cross-sectional view illustrating a device 100 in accordancewith one or more embodiments of the present disclosure.

The device 100 is a gated MIS-tunnel diode, which has a negativetransconductance property when the gate electrode 110 is biased from aninversion region to a flat-band region, as will be described in furtherdetail below.

The device 100 includes a substrate 102, which may be a substrate of anysemiconductor material. In some embodiments, the substrate 102 is asilicon substrate; however, embodiments provided herein are not limitedthereto. For example, in various embodiments, the substrate 102 mayinclude gallium arsenide (GaAs), gallium nitride (GaN), silicon carbide(SiC), or any other semiconductor material. The substrate 102 mayinclude various doping configurations depending on designspecifications. In some embodiments, the substrate 102 is a p-typesubstrate having a concentration of p-type dopants. In otherembodiments, the substrate 102 is a n-type substrate having aconcentration of n-type dopants. The substrate 102 includes a dopedregion 114 that is doped with dopants of the same conductivity type asthe substrate 102. For example, in embodiments where the substrate 102is a p-type substrate, the doped region 114 includes p-type dopants, andin embodiments where the substrate 102 is a n-type substrate, the dopedregion 114 includes n-type dopants. The doped region 114 has a higherconcentration of the dopants (whether p-type or n-type) than thesurrounding portions (e.g., a bulk region) of the substrate 102. In someembodiments where the substrate 102 is an n-type substrate, the dopantconcentration of the substrate 102 may be within a range from n_(i) to0.01*N_(N), inclusive, where n_(i) is the intrinsic carrierconcentration of the substrate 102 and N_(c) is the effective density ofstates in the conduction band. In some embodiments where the substrate102 is a p-type substrate, the dopant concentration of the substrate 102may be within a range from n_(i) to 0.01*N, inclusive, where N, is theeffective density of states in the valence band. In some embodimentswhere the substrate 102 is an n-type substrate, the dopant concentrationof the doped region 114 may be within a range from 0.01*N_(c) to 1*N,inclusive, and in some embodiments where the substrate 102 is a p-typesubstrate, the dopant concentration of the doped region 114 may bewithin a range from 0.01*N, to 1*N_(v), inclusive.

A tunnel diode dielectric layer 104 is disposed on a surface (e.g.,upper surface as shown in FIG. 1) of the substrate 102, and a tunneldiode electrode 106 is disposed on the tunnel diode dielectric layer104. In some embodiments, the tunnel diode dielectric layer 104 is anoxide layer, such as silicon dioxide (SiO₂) or hafnium dioxide (HfO₂).In some embodiments, the tunnel diode dielectric layer 104 may be amulti-layer structure such as a layered stack of SiO₂ and HfO₂. Thetunnel diode electrode 106 may be formed of any material suitable foruse as an electrode, and may be, for example, a metal electrode. Thematerial used for the tunnel diode electrode 106 may be selected so thatthe majority carriers will encounter a Schottky barrier while tunnelingthrough the tunnel diode dielectric layer 104 from the tunnel diodeelectrode 106 to the substrate 102. In some embodiments, the tunneldiode electrode 106 is formed of a material having a Schottky barrierheight that is large enough that it can be significantly modulated bythe tunnel diode dielectric layer 104 voltage (e.g., the voltage acrossthe tunnel diode dielectric layer 104), as will be discussed in furtherdetail later herein. In various embodiments, the tunnel diode electrode106 may include one or more of aluminum (Al), tantalum nitride (TaN),and titanium aluminide (TiAl). In some embodiments, the tunnel diodeelectrode 106 may be a multi-layer structure such as a layered stack ofTaN, TiAl, and Al.

The tunnel diode dielectric layer has a thickness (e.g., between thesubstrate 102 and the tunnel diode electrode 106) that is suitable forquantum tunneling through the tunnel diode dielectric layer 104. In someembodiments, the thickness of the tunnel diode dielectric layer 104 maybe less than 10 nm. In some embodiments, the thickness of the tunneldiode dielectric layer 104 is less than 4 nm.

A gate dielectric layer 108 is disposed on the surface of the substrate102 adjacent to the tunnel diode dielectric layer 104. In someembodiments, the gate dielectric layer 108 may contact the tunnel diodedielectric layer 104, for example, with side surfaces of the gatedielectric layer 108 and the tunnel diode dielectric layer 104 being incontact with one another. The gate dielectric layer 108 may be an oxidelayer, such as silicon dioxide (SiO₂) or hafnium dioxide (HfO₂). In someembodiments, the gate dielectric layer 108 may be a multi-layerstructure such as a layered stack of SiO₂ and HfO₂. The gate dielectriclayer 108 may have a thickness (e.g., between the substrate 102 and thegate electrode 110) that is greater than the thickness of the tunneldiode dielectric layer 104. In some embodiments, the gate dielectriclayer 108 may have a thickness that is greater than 4 nm, and in someembodiments, the gate dielectric layer 108 may be a thickness that isgreater than 10 nm. In some embodiments, the tunnel diode dielectriclayer 104 and the gate dielectric layer 108 may have a same thickness.

The gate electrode 110 is disposed on the gate dielectric layer 108 andis spaced apart from the tunnel diode electrode 106 by a distance thatis small enough that the voltage drop across the tunnel diode dielectriclayer 104 can be modulated by the variation of minority carrierconcentration induced by a gate bias (i.e., by a voltage applied to thegate electrode 110). In some embodiments, the gate electrode 110 isspaced apart from the tunnel diode electrode 106 by a distance that isless than 10 μm. In some embodiments, the gate electrode 110 is spacedapart from the tunnel diode electrode 106 by a distance that is lessthan 100 nm.

The gate electrode 110 may be formed of any material suitable for use asan electrode, and may be, for example, a metal electrode. In variousembodiments, the gate electrode 110 may include one or more of aluminum(Al), tantalum nitride (TaN), and titanium aluminide (TiAl). In someembodiments, the gate electrode 110 may be a multi-layer structure suchas a layered stack of TaN, TiAl, and Al. In some embodiments, the gateelectrode 110 and the tunnel diode electrode 106 may be formed of thesame material or materials.

The device 100 further includes a substrate electrode 112, which isprovided on the doped region 114 of the substrate 102. The substrateelectrode 112 is spaced apart from the tunnel diode electrode 106, withthe tunnel diode electrode 106 positioned between the gate electrode 110and the substrate electrode 112. The substrate electrode 112 may beformed of any suitable material, and may be, for example, a metalelectrode. In some embodiments, the substrate electrode 112 may includeone or more of aluminum (Al), tantalum nitride (TaN), and titaniumaluminide (TiAl). In some embodiments, the substrate electrode 112 maybe a multi-layer structure such as a layered stack of TaN, TiAl, and Al.

As mentioned previously herein, the device 100 is a gated MIS-tunneldiode. The device 100 may be considered as including two separate tunneldiodes. For example, the device 100 includes a first tunnel diode 121(which may be referred to as a sensing tunnel diode) that includes thetunnel diode electrode 106, the tunnel diode dielectric layer 104 andunderlying portions of the substrate 102. The device 100 furtherincludes a second tunnel diode 122 (which may be referred to as acontrol tunnel diode) adjacent to the first tunnel diode 121 and whichincludes the gate electrode 110, the gate dielectric layer 108 andunderlying portions of the substrate 102.

The saturation current of the first tunnel diode 121 is exponentiallydependent on the effective Schottky barrier height. The effectiveSchottky barrier height is linear with respect to the tunnel diodedielectric layer 104 voltage (e.g., the voltage across the tunnel diodedielectric layer 104). The tunnel diode dielectric layer 104 voltage, inturn, can be changed by the substrate surface electron concentration,which can be modulated by a bias applied to the gate electrode 110 ofthe second tunnel diode 122. Accordingly, while biasing the gateelectrode 110 from an inversion region to a flat band region, theelectron concentration decreases and the saturation current of the firsttunnel diode 121 dramatically decreases, which results in negativetransconductance of the first tunnel diode 121.

During operation, a voltage applied to the tunnel diode electrode 106causes majority charge carriers (e.g., holes) to tunnel through thetunnel diode dielectric layer 104 with a majority carrier current I_(h).The negative transconductance of the first tunnel diode 121 iscontrolled by a voltage applied to the gate electrode 110 of the secondtunnel diode 122. The behavior of the first tunnel diode 121 with twodifferent voltages applied to the gate electrode 110 will now bedescribed in further detail below.

In a first case, when a voltage V_(G) applied to the gate electrode 110is greater than the flat band voltage V_(FB) (i.e., V_(G)>V_(FB)), theminority carrier (e.g., electrons) concentration, n_(e), under the gateelectrode 110 is increased. The electron flux, F_(e), toward the firsttunnel diode 121 is therefore also increased. Hence, the inversion levelof the first tunnel diode 121 increases, which in turn increases thetunnel diode dielectric layer 104 voltage (which may be referred to asthe tunnel oxide voltage V_(ox)). The increase in the tunnel oxidevoltage V_(ox) causes a decrease in the effective Schottky barrierheight 4 of the first tunnel diode 121. The majority carrier current(I_(h)) increases exponentially with decreasing ϕ_(h)*, i.e., I_(h)∝exp(−qϕ_(h)*/kT). The saturation current of the first tunnel diode 121,I_(TD,sat), is dominated by the majority carrier current I_(h), i.e.,I_(TD,sat)≈I_(h).

In a second case, when the voltage V_(G) applied to the gate electrode110 is equal to the flat band voltage V_(FB) (V_(G)=V_(FB)), theminority carrier concentration n_(e) is decreased. Hence, the saturationcurrent of the first tunnel diode 121 I_(TD,sat) is decreased. Thesaturation current of the first tunnel diode 121 in the first case(i.e., I_(TD,sat)(V_(G)>V_(FB))) is significantly larger than in thesecond case (i.e., I_(TD,sat) (V_(G)=V_(FB))), which results in thenegative transconductance behavior of the device 100.

Accordingly, voltages applied to the gate electrode 110 of the controltunnel diode 122 can modulate the Schottky barrier height by controllingminority carrier concentration n_(e) and thereby controlling the tunneloxide voltage V_(ox).

The negative transconductance behavior of device 100 depends, at leastin part, on the thickness (d_(ox)) of the tunnel diode dielectric layer104. More particularly, when V_(G)>V_(FB), the minority carrierconcentration n_(e) is dominated by the inversion charge concentrationn_(inv). The inversion charge concentration n_(inv) increases with anincrease in the tunnel diode dielectric layer 104 thickness d_(ox),since the tunneling rate is decreased with a thicker dielectric layerand more inversion charges are held at the surface of the substrate 102.Accordingly, the peak current I_(peak) of the first tunnel diode 121increases with an increase in the thickness d_(ox) of the tunnel diodedielectric layer 104.

On the other hand, when V_(G)<V_(FB), the minority carrier concentrationn_(e) is dominated by the electron concentration due to gate injectionn_(inj), which decreases with an increase in the tunnel diode dielectriclayer 104 thickness d_(ox), since the tunneling rate is decreased with athicker dielectric layer. Accordingly, the valley I_(valley) of thetunneling current of the first tunnel diode 121 decreases with anincrease in the thickness d_(ox) of the tunnel diode dielectric layer104. Since the peak I_(peak) of the tunneling current increases and thevalley I_(valley) of the tunneling current decreases with an increase inthe thickness d_(ox) of the tunnel diode dielectric layer 104, thepeak-to-valley current ratio (PVCR) also increases with an increase inthe thickness d_(ox) of the tunnel diode dielectric layer 104. Moreparticularly, in some embodiments, the PVCR increases from 1 order ofmagnitude to 6 orders of magnitude as the thickness d_(ox) of the tunneldiode dielectric layer 104 is increased from 2.2 nm to 3.3 nm. Forexample, in some embodiments, the PVCR has a value of about 1×10¹ whenthe thickness d_(ox) of the tunnel diode dielectric layer 104 is 2.2 nm,and the PVCR has a value of about 1.3×10⁶ when the thickness d_(ox) ofthe tunnel diode dielectric layer 104 is 3.3 nm. In some embodiments,the thickness d_(ox) of the tunnel diode dielectric layer 104 may bewithin a range from 2 nm to 4 nm, inclusive.

FIGS. 2A to 2H are cross-sectional views illustrating a method offorming a gated MIS-tunnel diode device, such as the device 100, in someembodiments.

As shown in FIG. 2A, a first dielectric layer 208 is formed on asubstrate 102. In some embodiments, the substrate 102 is a siliconsubstrate; however, embodiments provided herein are not limited thereto.For example, in various embodiments, the substrate 102 may includegallium arsenide (GaAs), gallium nitride (GaN), silicon carbide (SiC),or any other semiconductor material. In some embodiments, the substrate102 is a p-type substrate having a concentration of p-type dopants, andin other embodiments the substrate 102 is a n-type substrate having aconcentration of n-type dopants.

In some embodiments, the first dielectric layer 208 is an oxide layer,such as silicon dioxide (SiO₂) or hafnium dioxide (HfO₂). In someembodiments, the first dielectric layer 208 is a multi-layer structuresuch as a layered stack of SiO₂ and HfO₂. The first dielectric layer 208may be formed by any suitable process, including, for example,deposition, anodization, thermal oxidation, or the like. In someembodiments, the first dielectric layer 208 is formed by a depositionprocess. The deposition process may be any suitable deposition processfor depositing a dielectric layer, including, for example, chemicalvapor deposition (CVD), low-pressure chemical vapor deposition (LPCVD),plasma-enhanced chemical vapor deposition (PECVD), plasma vapordeposition (PVD), atomic layer deposition (ALD), or the like.

As shown in FIG. 2B, the gate dielectric layer 108 is formed by removingportions of the first dielectric layer 208. The portions of the firstdielectric layer 208 may be removed by any suitable process, including,for example, by an etching process. In some embodiments, a mask isformed over the first dielectric layer 208 and exposes portions of thefirst dielectric layer 208 that will be removed. An etchant may then beutilized to remove the exposed portions of the first dielectric layer208. Any suitable etchant may be utilized, including, for example, anysuitable dry etchant or wet etchant such as hydrofluoric acid. The maskmay then be removed, leaving the gate dielectric layer 108 on thesubstrate 102.

As shown in FIG. 2C, a second dielectric layer 204 is formed on thesubstrate 102 adjacent to the gate dielectric layer 108. In someembodiments, the second dielectric layer 204 is an oxide layer, such assilicon dioxide (SiO₂) or hafnium dioxide (HfO₂). In some embodiments,the second dielectric layer 204 is a multi-layer structure such as alayered stack of SiO₂ and HfO₂. In some embodiments, the seconddielectric layer 204 is formed of a same material as the firstdielectric layer 208.

The second dielectric layer 204 may be formed by any suitable process,including, for example, deposition, anodization, thermal oxidation, orthe like. In some embodiments, the second dielectric layer 204 may beformed by a deposition process, including, for example, chemical vapordeposition (CVD), low-pressure chemical vapor deposition (LPCVD),plasma-enhanced chemical vapor deposition (PECVD), plasma vapordeposition (PVD), atomic layer deposition (ALD), or the like.

In some embodiments, the second dielectric layer 204 has a thicknessthat is less than a thickness of the gate dielectric layer 108, as shownin FIG. 2C. In some embodiments, the second dielectric layer 204 mayhave a thickness that is less than 10 nm, and in some embodiments, thesecond dielectric layer 204 may have a thickness that is less than 4 nm.In some embodiments, the tunnel diode dielectric layer 104 and the gatedielectric layer 108 may have a same thickness.

In some embodiments, the second dielectric layer 204 contacts the gatedielectric layer 108, for example, at side surfaces of the gatedielectric layer 108 and the second dielectric layer 204.

As shown in FIG. 2D, a doped region 114 is formed in the substrate 102.In some embodiments, the doped region 114 is formed by an implantationprocess in which a dopant species is implanted into the substrate 102.The implanted dopants may have a same conductivity type as the substrate102. For example, in embodiments where the substrate 102 is a p-typesubstrate, the doped region 114 includes p-type dopants, and inembodiments where the substrate 102 is a n-type substrate, the dopedregion 114 includes n-type dopants. The doped region 114 has a higherconcentration of the dopants (whether p-type or n-type) than thesurrounding portions of the substrate 102. In some embodiments where thesubstrate 102 is an n-type substrate, the dopant concentration of thesubstrate 102 may be within a range from n_(i) to 0.01*N, inclusive,where n_(i) is the intrinsic carrier concentration of the substrate 102and N_(N) is the effective density of states in the conduction band. Insome embodiments where the substrate 102 is a p-type substrate, thedopant concentration of the substrate 102 may be within a range fromn_(i) to 0.01*N_(v), inclusive, where N, is the effective density ofstates in the valence band. In some embodiments where the substrate 102is an n-type substrate, the dopant concentration of the doped region 114may be within a range from 0.01*N_(N) to 1*N_(N), inclusive, and in someembodiments where the substrate 102 is a p-type substrate, the dopantconcentration of the doped region 114 may be within a range from 0.01*Nto 1*N_(v), inclusive.

The doped region 114 has a width (e.g., along the horizontal directionas shown in FIG. 2D) that overlaps with the substrate electrode 112(FIG. 2H). In some embodiments, the doped region 114 does not overlapwith the tunnel diode electrode 106 or any other neighboring electrodes.In some embodiments, the depth of the doped region 114 may be within arange from several hundreds of micrometers to several nanometers,inclusive. In some embodiments, the doped region 114 may be omitted, forexample, if the contact between the substrate electrode 112 and thesubstrate 102 is ohmic.

In some embodiments, the dopants may be implanted into the doped region114 through the second dielectric layer 204. In other embodiments, thedopants may be implanted into the doped region 114 after portions of thesecond dielectric layer 204 have been removed to form the tunnel diodedielectric layer 104 (FIG. 2E). The dopants may be implanted through amask which exposes portions of the second dielectric layer 204 and/orthe substrate 102 through which the dopants are implanted.

As shown in FIG. 2E, the tunnel diode dielectric layer 104 is formed byremoving portions of the second dielectric layer 204, for example, by anetching process. In some embodiments, a mask is formed over the seconddielectric layer 204 and exposes portions of the second dielectric layer204 that will be removed. An etchant may then be utilized to remove theexposed portions of the second dielectric layer 204. Any suitableetchant may be utilized, including, for example, any suitable dryetchant or wet etchant such as hydrofluoric acid. The mask may then beremoved, leaving the tunnel diode dielectric layer 104 on the substrate102. The tunnel diode dielectric layer 104 may have a thickness that isless than a thickness of the gate dielectric layer 108, as shown. Insome embodiments, the thickness of the tunnel diode dielectric layer 104may be less than 10 nm. In some embodiments, the thickness of the tunneldiode dielectric layer 104 is less than 4 nm. In some embodiments, thethickness of the tunnel diode dielectric layer 104 is within a rangefrom 2 nm to 4 nm, inclusive.

As shown in FIG. 2F, a gate electrode 110 is formed on the gatedielectric layer 108. The gate electrode 110 may be formed of anymaterial suitable for use as an electrode, and may be, for example, ametal. The gate electrode 110 may be formed by depositing one or more ofaluminum (Al), tantalum nitride (TaN), and titanium aluminide (TiAl) onthe gate dielectric layer 108 and patterning the deposited materials toform the gate electrode 110. In some embodiments, the gate electrode 110may be formed as a multi-layer structure such as a layered stack of TaN,TiAl, and Al. Such a multi-layer structure may be formed by depositionof TaN, TiAl, and Al, in any order or sequence.

In some embodiments, the gate electrode 110 is formed to have to have awidth that is less than a width of the gate dielectric layer 108. Thatis, as shown in FIG. 2F, portions of the gate dielectric layer 108 mayextend laterally beyond opposite side surfaces of the gate electrode110.

As shown in FIG. 2G, a tunnel diode electrode 106 is formed on thetunnel diode dielectric layer 104. The tunnel diode electrode 106 may beformed of any material suitable for use as an electrode, and may be, forexample, a metal. The tunnel diode electrode 106 may be formed bydepositing one or more of aluminum (Al), tantalum nitride (TaN), andtitanium aluminide (TiAl) on the tunnel diode dielectric layer 104 andpatterning the deposited material to form the tunnel diode electrode106. In some embodiments, the tunnel diode electrode 106 may be formedas a multi-layer structure such as a layered stack of TaN, TiAl, and Al.Such a multi-layer structure may be formed by deposition of TaN, TiAl,and Al, in any order or sequence. In some embodiments, the gateelectrode 110 and the tunnel diode electrode 106 may be formed by a sameprocess, e.g., by deposition and patterning of the gate electrode 110and the tunnel diode electrode 106.

The tunnel diode electrode 106 is formed to be spaced apart laterallyfrom the gate electrode 110. In some embodiments, the tunnel diodeelectrode 106 is spaced apart from the gate electrode 110 by distancethat is less than 10 μm. In some embodiments, the tunnel diode electrode106 is spaced apart from the gate electrode 110 by a distance that isless than 100 nm.

As shown in FIG. 2H, a substrate electrode 112 is formed on the dopedregion 114. The substrate electrode 112 may be formed of any materialsuitable for use as an electrode, and may be, for example, a metal. Thesubstrate electrode 112 may be formed, for example, by depositing one ormore of aluminum (Al), tantalum nitride (TaN), and titanium aluminide(TiAl) on the doped region 114 and patterning the deposited materials toform the substrate electrode 112. In some embodiments, the substrateelectrode 112 may be formed as a multi-layer structure such as a layeredstack of TaN, TiAl, and Al. Such a multi-layer structure may be formedby deposition of TaN, TiAl, and Al, in any order or sequence.

The substrate electrode 112 is spaced apart from the tunnel diodeelectrode 106, with the tunnel diode electrode 106 positioned betweenthe gate electrode 110 and the substrate electrode 112.

FIG. 3 is a cross-sectional view illustrating a device 300 in accordancewith one or more embodiments of the present disclosure. Similar to thedevice 100 shown in FIG. 1, the device 300 is a gated MIS-tunnel diodewhich has a negative transconductance property when a gate electrode isbiased from an inversion region to a flat-band region. However, thedevice 300 has a different structure than the device 100 of FIG. 1. Morespecifically, the device 300 is a gated MIS-tunnel diode having avertical or fin structure.

The device 300 includes a substrate 302, which may be a substrate of anysemiconductor material. In some embodiments, the substrate 302 is asilicon substrate; however, embodiments provided herein are not limitedthereto. In some embodiments, the substrate 302 is a p-type substratehaving a concentration of p-type dopants. In other embodiments, thesubstrate 302 is a n-type substrate having a concentration of n-typedopants. A doped region 314 is formed in the substrate 302, and in someembodiments the doped region 314 is doped with dopants of the sameconductivity type as the substrate 102. The doped region 314 has ahigher concentration of the dopants (whether p-type or n-type) than thesurrounding portions of the substrate 302.

A semiconductor fin 350 extends outwardly from a surface (e.g., an uppersurface, as shown in FIG. 3) of the substrate 302. The fin 350 may beformed of the same material, and may have a same conductivity type, asthe substrate 302. In some embodiments, the fin 350 is an extension orprotruding portion of the substrate 302.

A first dielectric layer 304 is disposed on a surface of the substrate302 and covers the fin 350. In some embodiments, the first dielectriclayer 304 may surround the fin 350, with the first dielectric layer 304covering side surfaces and an upper surface of the fin 350. In someembodiments, the first dielectric layer 304 is an oxide layer, such assilicon dioxide (SiO₂) or hafnium dioxide (HfO₂). In some embodiments,the first dielectric layer 304 may be a multi-layer structure such as alayered stack of SiO₂ and HfO₂. In some embodiments, the thickness ofthe first dielectric layer 304 may be less than 10 nm. In someembodiments, the thickness of the first dielectric layer 304 is lessthan 4 nm.

A metal layer 360 is disposed on the first dielectric layer 304. Themetal layer 360 includes a first portion 361 that extends in a firstdirection (e.g., a horizontal direction as shown in FIG. 3) and a secondportion 362 that extends in a second direction (e.g., a verticaldirection as shown in FIG. 3) that is transverse to the first direction.The second portion 362 of the metal layer 360 may completely surroundsides of a portion of the fin 350. For example, in some embodiments, thesecond portion 362 of the metal layer 360 surrounds sides of a lowerportion of the fin 350, i.e., between an upper surface of the secondportion 362 of the metal layer 360 and an upper surface of the substrate302 from which the fin 350 extends. The second portion 362 of metallayer 360 has an upper surface that is below an upper surface of the fin350. The metal layer 360 may be formed of any suitable metal. In someembodiments, the metal layer 360 may include one or more of aluminum(Al), tantalum nitride (TaN), and titanium aluminide (TiAl). In someembodiments, the metal layer 360 may be a multi-layer structure such asa layered stack of TaN, TiAl, and Al.

A gate electrode 310 is disposed on the metal layer 360. In someembodiments, the gate electrode 310 is disposed on the first portion 361of the metal layer 360, and is spaced apart laterally from the secondportion 362 of the metal layer 360. The gate electrode 310 may be formedof any material suitable for use as an electrode, and may be, forexample, a metal electrode. In various embodiments, the gate electrode310 may include one or more of aluminum (Al), tantalum nitride (TaN),and titanium aluminide (TiAl). In some embodiments, the gate electrode310 may be a multi-layer structure such as a layered stack of TaN, TiAl,and Al.

An isolation dielectric layer 340 is disposed on the metal layer 360. Insome embodiments, the isolation dielectric layer 340 abuts side surfacesof the gate electrode 310. The isolation dielectric layer 340 may extendover a first edge of the first portion 361 of the metal layer 360, e.g.,beyond the left edge of the metal layer 360, as shown in FIG. 3, and maycontact the first dielectric layer 304. In some embodiments, theisolation dielectric layer 340 extends laterally to a second edge of thefirst portion 361 of the metal layer 360, e.g., the right edge of themetal layer 360 shown in FIG. 3.

The isolation dielectric layer 340 extends in the second direction(e.g., the vertical direction shown in FIG. 3) over the second portion362 of the metal layer 360. In some embodiments, the isolationdielectric layer 340 covers an upper surface of the second portion 362of the metal layer 360 and is in contact with the first dielectric layer304 along a length of a portion of the fin 350 that extends along thesecond direction beyond an upper surface of the second portion 362 ofthe metal layer 360. The isolation dielectric layer 340 may be anysuitable dielectric material, and in some embodiments the isolationdielectric layer 340 may be an oxide.

A tunnel diode electrode 306 is disposed on the first dielectric layer304 over the upper surface of the fin 350. In some embodiments, thetunnel diode electrode 306 contacts the upper surface of the isolationdielectric layer 340 and extends along the second direction (e.g., thevertical direction shown in FIG. 3) and over the first dielectric layer304 on the upper surface of the fin 350. The tunnel diode electrode 306may be spaced apart from the metal layer 360 by the isolation dielectric340.

The tunnel diode electrode 306 may be formed of any material suitablefor use as an electrode, and may be, for example, a metal electrode. Invarious embodiments, the tunnel diode electrode 306 may include one ormore of aluminum (Al), tantalum nitride (TaN), and titanium aluminide(TiAl). In some embodiments, the tunnel diode electrode 306 may be amulti-layer structure such as a layered stack of TaN, TiAl, and Al. Insome embodiments, the tunnel diode electrode 306 and the gate electrode310 may be formed of the same material or materials.

A substrate electrode 312 is disposed on the doped region 314 of thesubstrate 302. The substrate electrode 312 is spaced apart from themetal layer 360, and in some embodiments, the substrate electrode 312 ispositioned opposite the gate electrode 310, with the fin 350 and tunneldiode electrode 306 positioned between the substrate electrode 312 andthe gate electrode 310. In some embodiments, portions of the firstdielectric layer 304 and the isolation dielectric layer 340 extendbetween the doped region 314 and a side edge of the metal layer 360.

The substrate electrode 312 may be formed of any suitable material, andmay be, for example, a metal electrode. In some embodiments, thesubstrate electrode 312 may include one or more of aluminum (Al),tantalum nitride (TaN), and titanium aluminide (TiAl). In someembodiments, the substrate electrode 312 may be a multi-layer structuresuch as a layered stack of TaN, TiAl, and Al.

The device 300 operates in a substantially similar manner as describedabove with respect to the device 100. A first portion of the firstdielectric layer 304 between the fin 350 and the tunnel diode electrode306 may correspond to the tunnel diode dielectric layer 104 of thedevice 100, and a second portion of the first dielectric layer 304between the metal layer 360 and the substrate 302 may correspond to thegate dielectric layer 108 of the device 100.

During operation of the device 300, a voltage applied to the tunneldiode electrode 306 causes majority charge carriers (e.g., holes) totunnel through the first portion of the first dielectric layer 304(i.e., the portion between the tunnel diode electrode 306 and the fin350) with a majority carrier current I_(h). The negativetransconductance of the device 300 may be controlled by a voltageapplied to the metal layer 360 via the gate electrode 310.

FIGS. 4A to 4E are cross-sectional views illustrating a method offorming a gated MIS-tunnel diode device, such as the device 300, in someembodiments.

As shown in FIG. 4A, a fin 350 is formed on a substrate 302. In someembodiments, the fin 350 may be a part of the substrate 302, and may beformed by selectively etching the substrate 302. For example, a mask maybe formed over a portion of the substrate 302 which will become the fin350, and the surrounding portions may be exposed to an etchant thatetches into the substrate 302 to form recessed surfaces surrounding thefin 350. The fin 350 may extend outwardly (e.g., in the verticaldirection as shown) from the recessed surface of the substrate 302.

As shown in FIG. 4B, a first dielectric layer 304 is formed on thesurface of the substrate 302 and on the fin 350. In some embodiments,the first dielectric layer 304 may surround the fin 350, with the firstdielectric layer 304 covering side surfaces and an upper surface of thefin 350. In some embodiments, the first dielectric layer 304 is an oxidelayer, such as silicon dioxide (SiO₂) or hafnium dioxide (HfO₂). In someembodiments, the first dielectric layer 304 may be a multi-layerstructure such as a layered stack of SiO₂ and HfO₂. The first dielectriclayer 304 may be formed by any suitable process, including, for example,deposition, anodization, thermal oxidation, or the like. In someembodiments, the first dielectric layer 308 is formed by a depositionprocess. In some embodiments, the thickness of the first dielectriclayer 304 may be less than 10 nm. In some embodiments, the thickness ofthe first dielectric layer 304 is less than 4 nm.

As shown in FIG. 4C, a metal layer 360 is formed on the first dielectriclayer 304. The metal layer 360 includes a first portion 361 that extendsin a first direction (e.g., a horizontal direction as shown in FIG. 3)and a second portion 362 that extends in a second direction (e.g., avertical direction as shown in FIG. 3) that is transverse to the firstdirection. The metal layer 360 may be formed of any suitable metal. Themetal layer 360 may be formed by depositing one or more of aluminum(Al), tantalum nitride (TaN), and titanium aluminide (TiAl) on the firstdielectric layer 304 and patterning the deposited materials to form themetal layer 360. In some embodiments, the metal layer 360 may be formedas a multi-layer structure such as a layered stack of TaN, TiAl, and Al.Such a multi-layer structure may be formed by deposition of TaN, TiAl,and Al, in any order or sequence.

As shown in FIG. 4D, an isolation dielectric layer 340 is formed overthe metal layer 360. In some embodiments, the isolation dielectric layer340 is formed to extend over edges of the first portion 361 of the metallayer 360, e.g., over the left and right edges of the metal layer 360,as shown in FIG. 4D. The isolation dielectric layer 340 contacts thefirst dielectric layer 304 beyond the side edges of the first portion361 of the metal layer 360. The isolation dielectric layer 340 extendsin the second direction (e.g., the vertical direction shown in FIG. 3)over the second portion 362 of the metal layer 360, and may cover anupper surface of the second portion 362 of the metal layer 360 andcontact the first dielectric layer 304 along a length of a portion ofthe fin 350 that extends along the second direction beyond an uppersurface of the second portion 362 of the metal layer 360. The isolationdielectric layer 340 may be formed of any suitable dielectric material,and in some embodiments the isolation dielectric layer 340 may be anoxide.

In some embodiments, the isolation dielectric layer 340 is formed bydeposition of a dielectric material. In some embodiments, the isolationdielectric layer 340 is formed by depositing a dielectric material overthe fin 350, including over the upper surface of the fin 350, and thenselectively removing portions of the deposited dielectric material toform the isolation dielectric layer 340. For example, portions of thedeposited dielectric material may be removed from over the upper surfaceof the fin 350 and from an upper portion of the fin 350 so that theisolation dielectric layer 340 has an upper surface that is below theupper surface of the fin 350 as shown in FIG. 4D.

As shown in FIG. 4E, a doped region 314 is formed in the substrate 302,a gate electrode 310 is formed, a tunnel diode electrode 306 is formed,and a substrate electrode 312 is formed.

In some embodiments, the doped region 314 is formed by an implantationprocess in which a dopant species is implanted into the substrate 302.The implanted dopants may have a same conductivity type as the substrate302. The doped region 314 has a higher concentration of the dopants(whether p-type or n-type) than the surrounding portions of thesubstrate 302. In some embodiments, the dopants may be implanted intothe doped region 314 through the first dielectric layer 304 and/or theisolation dielectric layer 340, and portions of the first dielectriclayer 304 and/or the isolation dielectric layer 340 may be selectivelyremoved to expose a surface of the doped region 314. In otherembodiments, the dopants may be implanted into the doped region 314after portions of the first dielectric layer 304 and the isolationdielectric layer 340 have been removed to expose the surface of thesubstrate 302 into which the dopants are implanted.

The substrate electrode 312 is formed on the doped region 314. Thesubstrate electrode 312 may be formed of any material suitable for useas an electrode, and may be, for example, a metal. The substrateelectrode 312 may be formed, for example, by depositing one or more ofaluminum (Al), tantalum nitride (TaN), and titanium aluminide (TiAl) onthe doped region 314 and patterning the deposited materials to form thesubstrate electrode 312. In some embodiments, the substrate electrode312 may be formed as a multi-layer structure such as a layered stack ofTaN, TiAl, and Al. Such a multi-layer structure may be formed bydeposition of TaN, TiAl, and Al, in any order or sequence.

The gate electrode 310 is formed on the metal layer 360. The gateelectrode 310 may be formed of any material suitable for use as anelectrode, and may be, for example, a metal. In some embodiments, aportion of the isolation dielectric layer 340 is removed (e.g., by anetching process or any other suitable technique) to expose part of thefirst portion 361 of the metal layer 360, and the gate electrode 310 isformed on and in contact with the exposed part of the first portion 361of the metal layer 360. The gate electrode 310 may be formed, forexample, by deposition. In some embodiments, the gate electrode 310includes one or more of aluminum (Al), tantalum nitride (TaN), andtitanium aluminide (TiAl). In some embodiments, the gate electrode 310may be formed as a multi-layer structure such as a layered stack of TaN,TiAl, and Al. Such a multi-layer structure may be formed by depositionof TaN, TiAl, and Al, in any order or sequence. In some embodiments, theisolation dielectric layer 340 abuts side surfaces of the gate electrode310.

The tunnel diode electrode 306 is formed on the first dielectric layer304 over the upper surface of the fin 350. In some embodiments, thetunnel diode electrode 306 contacts the upper surface of the isolationdielectric layer 340 and extends along the second direction (e.g., thevertical direction shown in FIG. 3) and over the first dielectric layer304 on the upper surface of the fin 350. The tunnel diode electrode 306may be spaced apart from the metal layer 360 by the isolation dielectric340.

The tunnel diode electrode 306 may be formed of any material suitablefor use as an electrode, and may be, for example, a metal electrode. Thetunnel diode electrode 306 may be formed, for example, by deposition. Insome embodiments, the tunnel diode electrode 306 includes one or more ofaluminum (Al), tantalum nitride (TaN), and titanium aluminide (TiAl). Insome embodiments, the tunnel diode electrode 306 may be formed as amulti-layer structure such as a layered stack of TaN, TiAl, and Al. Sucha multi-layer structure may be formed by deposition of TaN, TiAl, andAl, in any order or sequence.

In some embodiments, two or more of the substrate electrode 312, thegate electrode 310, and the tunnel diode electrode 306 may be formed ofthe same material or materials. In some embodiments, two or more of thesubstrate electrode 312, the gate electrode 310, and the tunnel diodeelectrode 306 may be formed by a same process, e.g., by deposition andpatterning of the substrate electrode 312, the gate electrode 310, andthe tunnel diode electrode 306.

FIGS. 5 through 14 are top plan views illustrating various layouts ofgated MIS-tunnel diode devices in accordance with embodiments of thepresent disclosure. Each of the devices illustrated in FIGS. 4 through14 operates in a similar manner as described herein with respect to thedevice 100 shown in FIG. 1 and the device 300 shown in FIG. 3. Moreparticularly, the devices illustrated in FIGS. 5 through 14 have anegative transconductance property when a gate electrode is biased froman inversion region to a flat-band region. Each of the devicesillustrated in FIGS. 5 through 14 includes a gate electrode and a tunneldiode electrode which are spaced apart from one another by a distance.In some embodiments, the distance between the gate electrode and thetunnel diode electrode is within a range from several micrometers toseveral angstroms, inclusive. In some embodiments, the distance betweenthe gate electrode and the tunnel diode electrode is less than 10 μm. Insome embodiments, the distance between the gate electrode and the tunneldiode electrode is less than 100 nm. Furthermore, each of the devicesillustrated in FIGS. 5 through 14 may include any of the featuresdescribed herein, including, for example, any of the features describedherein with respect to the device 100 shown in FIG. 1 and/or the device300 shown in FIG. 3.

In various embodiments of the devices shown in one or more of FIGS. 5through 14, the tunnel diode electrode and the gate electrode may havedimensions (including, for example, width, length, and thicknessdimensions) within a range from several hundreds of micrometers toseveral nanometers, inclusive.

FIG. 5 is a top plan view illustrating a device 400 which includes atunnel diode electrode 406, and a gate electrode 410 that laterallysurrounds the tunnel diode electrode 406. The tunnel diode electrode 406may have a substantially circular shape in top plan view. The gateelectrode 410 may have a substantially ring shape in top plan view.

The tunnel diode electrode 406 and the gate electrode 410 may be formedon a substrate, which may be substantially the same as the substrate 102of the device 100 shown in FIG. 1. In some embodiments, the device 400may include one or more of the features of the device 100 shown inFIG. 1. For example, in various embodiments, the device 400 may includethe doped region 114, the tunnel diode dielectric layer 104 (which maybe positioned between the substrate and the tunnel diode electrode 406),and the gate dielectric layer 108 (which may be positioned between thesubstrate and the gate electrode 410). In some embodiments, the device400 includes a substrate electrode (not shown) which may besubstantially the same as the substrate electrode 112 shown in FIG. 1 orthe substrate electrode 312 shown in FIG. 3. The substrate electrode maybe provided on a doped region and spaced apart from the gate electrode410, with the gate electrode 410 positioned between the tunnel diodeelectrode 406 and the substrate electrode.

In some embodiments, the device 400 may have a vertical or fin structureand may include one or more of the features of the device 300 shown inFIG. 3. For example, the tunnel diode electrode 406 may be disposed overa semiconductor fin, while the gate electrode 410 may be disposed on asurface of the substrate.

FIG. 6 is a top plan view illustrating a device 500 which includes atunnel diode electrode 506, and a gate electrode 510 that laterallysurrounds the tunnel diode electrode 506. The device 500 shown in FIG. 6is substantially the same as the device 400 shown in FIG. 5, except thatin the device 500, the tunnel diode electrode 506 has a substantiallyrectangular shape in top plan view. The gate electrode 510 has asubstantially rectangular inner perimeter in top plan view which isadjacent to, and spaced apart from, the tunnel diode electrode 506. Anouter perimeter of the gate electrode 510 similarly has a substantiallyrectangular shape in top plan view.

FIG. 7 is a top plan view illustrating a device 600 which includes agate electrode 610, and a tunnel diode electrode 606 that laterallysurrounds the gate electrode 610. The device 600 shown in FIG. 7 issubstantially the same as the device 400 shown in FIG. 5, except thatthe positions of the gate electrode 610 and the tunnel diode electrode606 are reversed with respect to the gate electrode 410 and the tunneldiode electrode 406 of the device 400.

FIG. 8 is a top plan view illustrating a device 700 which includes agate electrode 710, and a tunnel diode electrode 706 that laterallysurrounds the gate electrode 610. The device 700 shown in FIG. 6 issubstantially the same as the device 500 shown in FIG. 5, except thatthe positions of the gate electrode 710 and the tunnel diode electrode706 are reversed with respect to the gate electrode 510 and the tunneldiode electrode 506 of the device 500.

FIG. 9 is a top plan view illustrating a device 800 which includes agate electrode 810 and a tunnel diode electrode 806 provided in aparallel layout. The gate electrode 810 and the tunnel diode electrode806 may have substantially rectangular shapes in top plan view, and maybe spaced apart from one another as shown. In some embodiments, the sizeand shape of the gate electrode 810 and the tunnel diode electrode 806may be different from each other.

FIG. 10 is a top plan view illustrating a device 900 which includes agate electrode 910 and a tunnel diode electrode 906 provided in a“fingers” layout. The gate electrode 910 includes a plurality ofextending portions or fingers 911 that extend from a body of the gateelectrode 910. Similarly, the tunnel diode electrode 906 includes aplurality of extending portions or fingers 907 that extend from a bodyof the tunnel diode electrode 906. The fingers 911 of the gate electrode910 extend toward the body of the tunnel diode electrode 906, while thefingers 907 of the tunnel diode electrode 906 extend toward the body ofthe gate electrode 910. The fingers 911 of the gate electrode 910 andthe fingers 907 of the tunnel diode electrode 906 are alternatelyarranged, in top plan view, between the body of the gate electrode 910and the body of the tunnel diode electrode 906.

FIG. 11 is a top plan view illustrating a device 1000 which has amulti-gate layout. More specifically, the device 1000 includes a tunneldiode electrode 1006, and a plurality of gate electrodes 1010 ₁ through1010 _(N) that are provided around the tunnel diode electrode 1006 intop plan view. The tunnel diode electrode 1006 may have a substantiallycircular shape in top plan view, as shown; however, embodiments are notlimited thereto. In some embodiments, the tunnel diode electrode 1006may have any non-circular shape in top plan view, including, forexample, a rectangular shape, square shape, polygonal shape, or anyother shape.

The gate electrodes 1010 ₁ through 1010 _(N) may substantially surroundthe tunnel diode electrode 1006, with adjacent ones of the gateelectrodes 1010 ₁ through 1010 _(N) being spaced apart from one another.

FIG. 12 is a top plan view illustrating a device 1100 having amulti-gate layout. The device 1100 shown in FIG. 12 is substantially thesame as the device 1000 shown in FIG. 11, except that the positions ofthe gate electrode and the tunnel diode electrode are reversed in thedevice 1100 with respect to the gate electrode and the tunnel diodeelectrode of the device 1000. More specifically, the device 1100includes a gate electrode 1110 and a plurality of tunnel diodeelectrodes 1106 ₁ through 1106 _(N) that are provided around the gateelectrode 1110 in top plan view. The gate electrode 1110 may have asubstantially circular shape in top plan view, as shown; however,embodiments are not limited thereto. In some embodiments, the gateelectrode 1110 may have any non-circular shape in top plan view,including, for example, a rectangular shape, square shape, polygonalshape, or any other shape.

The tunnel diode electrodes 1106 ₁ through 1106 _(N) may substantiallysurround the gate electrode 1110, with adjacent ones of the tunnel diodeelectrodes 1106 ₁ through 1106 _(N) being spaced apart from one another.

FIG. 13 is a top plan view illustrating a device 1200 having amulti-gate layout. The device 1200 includes a tunnel diode electrode1206 that includes a first portion which extends in a first direction,and a second portion that extends in a second direction that istransverse to the first direction. Gate electrodes 1210 ₁ through 1210 ₄are adjacent to the tunnel diode electrode 1206 at various differentpositions. As shown in FIG. 13, the device 1200 may include four gateelectrodes 1210 ₁ through 1210 ₄; however, embodiments are not limitedthereto. Any number of gate electrodes may be included in the device1200 and spaced apart from the tunnel diode electrode 1206. In someembodiments, the gate electrodes 1210 ₁ through 1210 ₄ have variousdifferent sizes and shapes.

FIG. 14 is a top plan view illustrating a device 1300 having amulti-gate structure. The device 1300 shown in FIG. 14 is substantiallythe same as the device 1200 shown in FIG. 13, except that the gateelectrode and the tunnel diode electrode are reversed in the device 1300with respect to the gate electrode and the tunnel diode electrode of thedevice 1200. More specifically, the device 1300 includes a gateelectrode 1310 that includes a first portion which extends in a firstdirection, and a second portion that extends in a second direction thatis transverse to the first direction. Tunnel diode electrodes 1306 ₁through 1306 ₄ are adjacent to the gate electrode 1310 at variousdifferent positions. As shown in FIG. 14, the device 1300 may includefour tunnel diode electrodes 1306 ₁ through 1306 ₄; however, embodimentsare not limited thereto. Any number of tunnel diode electrodes may beincluded in the device 1300 and spaced apart from the gate electrode1310.

The present disclosure provides, in various embodiments, gated-MIStunnel diode devices that have a controllable negative transconductancebehavior. The devices may include a tunnel diode electrode that isbetween a gate electrode and a substrate electrode. During operation, avoltage applied to the tunnel diode electrode causes majority chargecarriers (e.g., holes) to tunnel through a tunnel diode dielectriclayer, and the negative transconductance of the device is controllableby a voltage applied to the gate electrode. In some embodiments, inwhich the thickness of the tunnel diode dielectric layer is betweenabout 2 nm to 4 nm, the peak-to-valley current ratio (PVCR) can beincreased by about 6 orders of magnitude.

According to one embodiment, a device includes a substrate having asurface. A tunnel diode dielectric layer is disposed on the surface ofthe substrate, and a gate dielectric layer is disposed on the surface ofthe substrate adjacent to the tunnel diode dielectric layer. A tunneldiode electrode is disposed on the tunnel diode dielectric layer, and agate electrode is disposed on the gate dielectric layer. A substrateelectrode is disposed on the surface of the substrate, with the tunneldiode electrode positioned between the gate electrode and the substrateelectrode.

According to another embodiment, a method is provided that includesforming a gate dielectric layer on a surface of a substrate. A tunneldiode dielectric layer is formed on the surface of the substrateadjacent to the gate dielectric layer. A gate electrode on is formed onthe gate dielectric layer. A tunnel diode electrode is formed on thetunnel diode dielectric layer. A doped region is formed in thesubstrate, with the tunnel diode electrode positioned between the gateelectrode and the doped region. A substrate electrode is formed on thedoped region.

According to yet another embodiment, a device includes a substrateincluding a bulk region having a first concentration of dopants of afirst conductivity type and a doped region having a second concentrationof dopants of the first conductivity type, the second concentrationbeing greater than the first concentration. The device includes asensing tunnel diode and a control tunnel diode that is adjacent to thesensing tunnel diode. The sensing tunnel diode includes a tunnel oxidelayer on the bulk region of the substrate and a tunnel diode electrodeon the tunnel oxide layer. The control tunnel diode includes a gateoxide layer on the substrate and a gate electrode on the gate oxidelayer. The device further includes a substrate electrode on the dopedregion of the substrate. The sensing tunnel diode is positioned betweenthe control tunnel diode and the substrate electrode. The foregoingoutlines features of several embodiments so that those skilled in theart may better understand the aspects of the present disclosure. Thoseskilled in the art should appreciate that they may readily use thepresent disclosure as a basis for designing or modifying other processesand structures for carrying out the same purposes and/or achieving thesame advantages of the embodiments introduced herein. Those skilled inthe art should also realize that such equivalent constructions do notdepart from the spirit and scope of the present disclosure, and thatthey may make various changes, substitutions, and alterations hereinwithout departing from the spirit and scope of the present disclosure.

The various embodiments described above can be combined to providefurther embodiments. These and other changes can be made to theembodiments in light of the above-detailed description. In general, inthe following claims, the terms used should not be construed to limitthe claims to the specific embodiments disclosed in the specificationand the claims, but should be construed to include all possibleembodiments along with the full scope of equivalents to which suchclaims are entitled. Accordingly, the claims are not limited by thedisclosure.

1. A device, comprising: a substrate having a surface; a tunnel diodedielectric layer on the surface of the substrate; a tunnel diodeelectrode on the tunnel diode dielectric layer; a gate dielectric layeron the surface of the substrate adjacent to the tunnel diode dielectriclayer; a gate electrode on the gate dielectric layer; and a substrateelectrode on the surface of the substrate, the tunnel diode electrodepositioned between the gate electrode and the substrate electrode. 2.The device of claim 1 wherein the substrate includes a doped region,wherein the substrate electrode contacts the doped region of thesubstrate.
 3. The device of claim 1 wherein the tunnel diode dielectriclayer is a multi-layer structure including a silicon dioxide (SiO₂)layer and a hafnium dioxide (HfO₂) layer.
 4. The device of claim 3wherein the gate dielectric layer is a multi-layer structure including asilicon dioxide (SiO₂) layer and a hafnium dioxide (HfO₂) layer.
 5. Thedevice of claim 1 wherein the tunnel diode electrode is a multi-layerstack including tantalum nitride (TaN), titanium aluminide (TiAl), andaluminum (Al).
 6. The device of claim 5 wherein the gate electrode is amulti-layer stack including TaN, TiAl, and Al.
 7. The device of claim 1wherein the tunnel diode dielectric layer has a thickness that is equalto or less than 4 nm.
 8. The device of claim 1 wherein the gatedielectric layer has a thickness that is greater than a thickness of thetunnel diode dielectric layer.
 9. The device of claim 1, furthercomprising: a fin on the surface of the substrate; and a metal layersurrounding at least a portion of the fin and between the gate electrodeand the gate dielectric layer; and an isolation dielectric layer betweenthe tunnel diode electrode and the metal layer, wherein the tunnel diodedielectric layer is disposed between the fin and the tunnel diodeelectrode, and the gate electrode contacts the metal layer.
 10. Thedevice of claim 9 wherein the tunnel diode dielectric layer and the gatedielectric layer are formed of a same layer of dielectric material. 11.The device of claim 1 wherein the gate electrode is spaced apart fromthe tunnel diode electrode by a distance equal to or less than 100 nm.12. The device of claim 1 wherein the tunnel diode electrode laterallysurrounds the gate electrode.
 13. The device of claim 1, furthercomprising a plurality of gate electrodes positioned about a peripheryof the tunnel diode electrode.
 14. The device of claim 1 wherein thetunnel diode electrode includes a plurality of fingers which extend froma body of the tunnel diode electrode toward a body of the gateelectrode, and the gate electrode includes a plurality of fingers whichextend from the body of the gate electrode toward the body of the tunneldiode electrode.
 15. A method, comprising: forming a gate dielectriclayer on a surface of a substrate; forming a tunnel diode dielectriclayer on the surface of the substrate adjacent to the gate dielectriclayer; forming a gate electrode on the gate dielectric layer; forming atunnel diode electrode on the tunnel diode dielectric layer; forming adoped region in the substrate, the tunnel diode electrode positionedbetween the gate electrode and the doped region; and forming a substrateelectrode on the doped region.
 16. The method of claim 15 wherein theforming the gate dielectric layer includes forming the gate dielectriclayer to have a first thickness, and wherein the forming the tunneldiode dielectric layer includes forming the tunnel diode dielectriclayer to have a second thickness that is less than the first thickness.17. The method of claim 16 wherein the forming the gate electrodeincludes forming the gate electrode as a first multi-layer stackincluding tantalum nitride (TaN), titanium aluminide (TiAl), andaluminum (Al), and wherein the forming the tunnel diode electrodeincludes forming the tunnel diode electrode as a second multi-layerstack including tantalum nitride (TaN), titanium aluminide (TiAl), andaluminum (Al).
 18. A method, comprising: applying a voltage to a gateelectrode of a control tunnel diode; and controlling a negativetransconductance behavior of a sensing tunnel diode adjacent to thecontrol tunnel diode, based on the voltage applied to the gate electrodeof the control tunnel diode, wherein the sensing tunnel diode includes atunnel oxide layer on a substrate, and a tunnel diode electrode on thetunnel oxide layer, the control tunnel diode includes a gate oxide layeron the substrate, the gate electrode disposed on the gate oxide layer,and a substrate electrode is disposed on a doped region of thesubstrate, the sensing tunnel diode positioned between the controltunnel diode and the substrate electrode.
 19. The method of claim 18wherein applying the voltage to the gate electrode of the control tunneldiode includes biasing the gate electrode of the control tunnel diodefrom an inversion region to a flat band region.
 20. The method of claim18 wherein controlling the negative transconductance behavior of thesensing tunnel diode includes modulating a Schottky barrier height ofthe sensing tunnel diode.